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Patent Searching and Data


Title:
CURABLE COMPOSITION, RESIST MATERIAL AND RESIST FILM
Document Type and Number:
WIPO Patent Application WO/2016/072202
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing the following: a curable composition which can be easily cleaned after curing, exhibits high resistance to dry etching and can form a resist having excellent transfer precision of a fine pattern; a resist film and laminate containing this curable composition; and a method for forming a pattern by using the resist film. The present invention solves this problem by providing a curable composition that contains a polyfunctional polymerizable monomer (A) which has two or more polymerizable groups and which has at least one group Q having a polymerizable group represented by formula (1). In the curable composition, the quantity of silicon atoms is 10 wt.% or more of the quantity of non-volatile components.

Inventors:
IBE TAKESHI (JP)
YAGI NAOTO (JP)
TANIMOTO HISASHI (JP)
YADA MAKOTO (JP)
Application Number:
PCT/JP2015/078321
Publication Date:
May 12, 2016
Filing Date:
October 06, 2015
Export Citation:
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Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F30/08; C07F7/18; C08F290/00; C08F299/08; H01L21/027; C08G77/20
Domestic Patent References:
WO2012111656A12012-08-23
Foreign References:
KR20110034710A2011-04-06
JP2013051410A2013-03-14
US20050136269A12005-06-23
Other References:
WANG SI-YUAN ET AL.: "The study of synthesis and photocuring behaviors of organic silicon modified methylacrylate and acrylate", PROCEEDINGS OF SPIE (2012), 8322(PT. 2, EXTREME ULTRAVIOLET (EUV) LITHOGRAPHY III, 29 March 2012 (2012-03-29), pages 83222G/1 - 83222G/7
Attorney, Agent or Firm:
KONO MICHIHIRO (JP)
Michihiro Kono (JP)
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