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Patent Searching and Data


Title:
CURABLE COMPOSITION, SEALING MATERIAL COMPOSITION, AND ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/058794
Kind Code:
A1
Abstract:
[Problem] To provide a curable composition, a sealing material composition, and an adhesive composition having excellent workability and providing a cured product with excellent mechanical properties and weather resistance. [Solution] Disclosed is a curable composition comprising: an oxyalkylene-based polymer (A) including a reactive silyl group; and a (meth)acrylic polymer (B). The (meth)acrylic polymer (B) includes, in the molecule thereof, from 0.01 meq/g to 1.0 meq/g double bonds. The (meth)acrylic polymer (B) may include, in the molecule thereof, from 0.1 to 2.2 reactive silyl groups.

Inventors:
MOCHIZUKI KATSUNOBU (JP)
Application Number:
PCT/JP2018/029551
Publication Date:
March 28, 2019
Filing Date:
August 07, 2018
Export Citation:
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Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08L33/04; C08F20/12; C08G65/336; C08L59/00
Domestic Patent References:
WO2016035718A12016-03-10
Foreign References:
JP2007023293A2007-02-01
JP2017088766A2017-05-25
JP6376301B12018-08-22
JP6376303B12018-08-22
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