Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE COMPOSITION, SEALING MATERIAL COMPOSITION, AND ADHESIVE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2019/058795
Kind Code:
A1
Abstract:
[Problem] To provide a curable composition, a sealing material composition, and an adhesive composition having excellent workability and providing a cured product with excellent mechanical properties and weather resistance. [Solution] Disclosed is a curable composition comprising: a (meth)acrylic polymer (A) having a weight-average molecular weight of 500 or greater to less than 10,000; and a (meth)acrylic polymer (B) having a weight-average molecular weight of from 10,000 to 100,000. The (meth)acrylic polymer (A) includes, in the molecule thereof, from 0.01 meq/g to 1.0 meq/g double bonds. The (meth)acrylic polymer (B) includes a reactive silyl group in the molecule thereof.

Inventors:
MOCHIZUKI KATSUNOBU (JP)
Application Number:
PCT/JP2018/029557
Publication Date:
March 28, 2019
Filing Date:
August 07, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
TOAGOSEI CO LTD (JP)
International Classes:
C08L33/06; C08F230/08; C08L71/02; C09J11/06; C09J133/00; C09J143/04; C09J171/02; C09K3/10
Domestic Patent References:
WO2014175358A12014-10-30
WO2005073322A12005-08-11
Foreign References:
JP2017088766A2017-05-25
JP2005179559A2005-07-07
JP2005171115A2005-06-30
JP2007023293A2007-02-01
JP2004244492A2004-09-02
JP2005082750A2005-03-31
JP6376302B12018-08-22
JP6376300B12018-08-22
Download PDF: