Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
CURABLE COMPOSITION, CURABLE COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/220664
Kind Code:
A1
Abstract:
A curable composition according to one aspect of the present invention contains: a compound having a (meth)acryloyl group; a capsule containing a heat storage component; and a polymerization initiator.

Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
Application Number:
PCT/JP2018/042161
Publication Date:
November 21, 2019
Filing Date:
November 14, 2018
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K5/06; C08F20/18; C08G59/20; C08K7/16; C08L33/04; C08L63/00
Foreign References:
JP2016089065A2016-05-23
JP2007029312A2007-02-08
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
Download PDF: