Title:
CURABLE COMPOSITION, CURABLE COMPOSITION SET, HEAT STORAGE MATERIAL, AND ARTICLE
Document Type and Number:
WIPO Patent Application WO/2019/220665
Kind Code:
A1
Abstract:
A curable composition according to one aspect of the present invention contains: an epoxy compound; a capsule containing a heat storage component; and a curing agent.
Inventors:
FURUKAWA NAOKI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
MORIMOTO TSUYOSHI (JP)
SANO ATSUKO (JP)
MATSUBARA NOZOMI (JP)
NAGAI AKIRA (JP)
KIZAWA KEIKO (JP)
YOKOTA HIROSHI (JP)
Application Number:
PCT/JP2018/042164
Publication Date:
November 21, 2019
Filing Date:
November 14, 2018
Export Citation:
Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09K5/06; C08F20/18; C08G59/22; C08K7/16; C08L63/00
Foreign References:
| JP2009029985A | 2009-02-12 | |||
| JP2017132899A | 2017-08-03 | |||
| JP2004026971A | 2004-01-29 |
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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