Title:
CURABLE COMPOSITION, STRUCTURE AND METHOD FOR FORMING SAME
Document Type and Number:
WIPO Patent Application WO/2020/012753
Kind Code:
A1
Abstract:
The present invention provides: a curable composition which is excellent in terms of the formation of a highly accurate multilayer wiring line and the like; a method for easily forming a structure such as a highly accurate multilayer wiring line; and a structure which is obtained with use of this curable composition. The present invention is a curable composition which contains (A) a polymer component which contains a structural unit having a group represented by formula (1), a structural unit having an alkoxysilyl group and a structural unit having a cyclic ether group in a same polymer or in different polymers, (B) an acid generator and (C) a solvent. In formula (1), each of R1 and R2 independently represents a hydrogen atom or a fluorine atom; n represents an integer of 1-10, and in cases where n is 2 or more, the plurality of R1 moieties may be the same as or different from each other and the plurality of R2 moieties may be the same as or different from each other; and * represents a bonding position.
Inventors:
ISHIKAWA SATORU (JP)
WADA MITSUHIRO (JP)
WADA MITSUHIRO (JP)
Application Number:
PCT/JP2019/017101
Publication Date:
January 16, 2020
Filing Date:
April 22, 2019
Export Citation:
Assignee:
JSR CORP (JP)
International Classes:
C08G59/20; B05D1/36; B05D3/06; B05D5/06; B05D7/24; B32B27/00; C08F220/26; C08G59/68; C08L33/04; C08L63/00; C09D7/20; C09D7/63; C09D201/04; C09D201/06; C09D201/10; H05K3/10
Domestic Patent References:
| WO2014178279A1 | 2014-11-06 | |||
| WO2017018129A1 | 2017-02-02 |
Foreign References:
| JP2000109694A | 2000-04-18 | |||
| JP2007293325A | 2007-11-08 | |||
| JP2000026546A | 2000-01-25 | |||
| JP2016087602A | 2016-05-23 | |||
| JP2016090639A | 2016-05-23 | |||
| JP2017049327A | 2017-03-09 | |||
| JP2006117915A | 2006-05-11 |
Attorney, Agent or Firm:
AMANO Kazunori (JP)
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