CURABLE COMPOSITION, THERMALLY CONDUCTIVE MATERIAL, THERMALLY CONDUCTIVE SHEET, DEVICE WITH THERMALLY CONDUCTIVE LAYER, AND COMPOUND

WIPO Patent Application WO/2021/230002

A1

The present invention provides a curable composition capable of giving thermally conductive materials having excellent thermal conductivity. Also provided are a thermally conductive material, a thermally conductive sheet, a device with a thermally conductive layer, and a compound, which each relate to the curable composition. This curable composition comprises a phenol compound, an epoxy compound, a curing accelerator, and an inorganic substance, wherein the phenol compound is a specific phenol compound satisfying requirement 1 and/or requirement 2 and the content of the inorganic substance exceeds 10 mass% based on all the solid components.　Requirement 1: To be a compound represented by general formula (Y).　Requirement 2: To be a phenol compound having a triazine skeleton and having an aromatic ring group that includes a phenolic hydroxyl group and a substituent arranged in an ortho position to the phenolic hydroxyl group.

HITOMI SEIICHI (JP)
HAYASHI DAISUKE (JP)
TAKAHASHI KEITA (JP)
NIORI TERUKI (JP)
OZAWA SHIN (JP)

PCT/JP2021/015744

November 18, 2021

April 16, 2021

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FUJIFILM CORP (JP)

C08G59/20; C07D251/70; C08G59/62; C08L63/00; C09K5/14

WO2019240079A1	2019-12-19
WO2019203292A1	2019-10-24
WO2019017053A1	2019-01-24
WO2019054707A1	2019-03-21

JP2010095645A	2010-04-30
JP2003502412A	2003-01-21
JP2011500751A	2011-01-06
JP2010254951A	2010-11-11
JPH09227432A	1997-09-02

ITOH Hideaki et al. (JP)

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