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Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2008/041768
Kind Code:
A1
Abstract:
Disclosed is a curable composition which can be cured quickly by light. This curable composition is not left uncured even in portions which are not irradiated with light. A cured product of this curable composition is excellent in heat resistance, oil resistance and weather resistance. Specifically disclosed is a curable composition characterized by containing a vinyl polymer having at least one crosslinkable silyl group on average and a vinyl polymer having at least one photocrosslinkable group on average.

Inventors:
HASEGAWA NOBUHIRO (JP)
Application Number:
PCT/JP2007/069583
Publication Date:
April 10, 2008
Filing Date:
October 05, 2007
Export Citation:
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Assignee:
KANEKA CORP (JP)
HASEGAWA NOBUHIRO (JP)
International Classes:
C08F299/00; C08L33/04; C08L101/02
Domestic Patent References:
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WO1996030421A11996-10-03
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Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-kuOsaka-shi, Osaka 88, JP)
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