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Patent Searching and Data


Title:
CURABLE COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/170908
Kind Code:
A1
Abstract:
A multiple package-type curable composition which comprises: an agent A that contains (A) a polyoxyalkylene polymer having a reactive silicon group, (B) a (meth)acrylic acid ester polymer having a reactive silicon group, and (D) an epoxy resin curing agent; and an agent B that contains (C) an epoxy resin and (E) a silanol condensation catalyst. The (meth)acrylic acid ester polymer (B) comprises, as constituent monomers, from 40% by weight to 70% by weight (inclusive) of (b1) a (meth)acrylic acid alkyl ester wherein an alkyl group has 1-3 carbon atoms, (b2) a monomer having a reactive silicon group and a polymerizable unsaturated group, and (b3) a macromonomer that is a (meth)acrylic acid ester polymer having a polymerizable unsaturated group.

Inventors:
MIYAFUJI KIYOSHI
Application Number:
PCT/JP2020/005346
Publication Date:
August 27, 2020
Filing Date:
February 12, 2020
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C09J11/06; C08L43/04; C08L63/00; C08L71/00; C09J143/04; C09J163/00; C09J171/00; C09J201/10
Domestic Patent References:
WO2017057719A12017-04-06
WO2018003688A12018-01-04
Foreign References:
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JPH02228365A1990-09-11
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JPH02214759A1990-08-27
JP2015105324A2015-06-08
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JPH1053637A1998-02-24
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Other References:
JOURNAL OF THE AMERICAN CHEMICAL SOCIETY (J. AM. CHEM. SOC., vol. 116, 1994, pages 7943
Attorney, Agent or Firm:
PATENT CORPORATE BODY ARCO PATENT OFFICE (JP)
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