CURABLE HOT-MELT SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND LAMINATE INCLUDING CURABLE HOT-MELT SILICONE COMPOSITION OR CURED PRODUCT THEREOF

WIPO Patent Application WO/2021/200643

A1

[Problem] To provide a hot-melt curable silicone composition that is curable at a low temperature of 100 °C or lower and is excellent in storage stability and that forms, through curing, a relatively hard cured product having less surface tack, as well as a sheet or a film comprising the same. [Solution] A curable hot-melt silicone composition of the present invention includes (A) a solid organopolysiloxane resin containing (A1) an organopolysiloxane resin that has a curing-reactive functional group and that contains 20 mol% or more of a Q unit, and (A2) an organopolysiloxane resin that does not have a curing-reactive functional group and that contains 20 mol% or more of a Q unit in a mass ratio of 0:100 to 90:10; (B) 10 to 100 parts by mass of a liquid or plastic, linear or branched organopolysiloxane that has a curing-reactive functional group; (C) an organohydrogenpolysiloxan; and (D) a photoactive hydrosilylation reaction catalyst, the composition as a whole having a hot-melt property.

YAMAZAKI RYOSUKE (JP)
YAMAMOTO SHINICHI (JP)
OZAKI KOUICHI (JP)
IMAIZUMI TORU (JP)

PCT/JP2021/012840

October 07, 2021

March 26, 2021

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DOW TORAY CO LTD (JP)

C08L83/07; B32B27/00; B32B27/16; B32B27/18; B32B27/26; C08L83/05; C09J183/05; C09J183/07; H01L23/29; H01L23/31

WO2019078140A1	2019-04-25
WO2019059351A1	2019-03-28
WO2019088067A1	2019-05-09
WO2020090797A1	2020-05-07
WO2016136243A1	2016-09-01

JP2013147546A	2013-08-01
JP2017520918A	2017-07-27
JP2014009322A	2014-01-20
JP2017512224W

See also references of EP 4130157A4

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