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Title:
CURABLE RESIN COMPOSITION AND ADHESIVE
Document Type and Number:
WIPO Patent Application WO/2022/186316
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition that achieves both vibration-damping properties and rigidity at high temperature. A curable resin composition according to the present invention contains an epoxy resin (A) and crosslinked polymer particles (B) having a specific structure.

Inventors:
OKAMOTO TOSHIHIKO (JP)
Application Number:
PCT/JP2022/009037
Publication Date:
September 09, 2022
Filing Date:
March 03, 2022
Export Citation:
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Assignee:
KANEKA CORP (JP)
International Classes:
C08F265/06; C08L51/00; C08L63/00; C08L75/04; C09J11/06; C09J11/08; C09J133/00; C09J151/06; C09J163/00
Foreign References:
JP2012180516A2012-09-20
JP2005255822A2005-09-22
JP2001323131A2001-11-20
US20070100074A12007-05-03
JPS62104888A1987-05-15
JPH11181245A1999-07-06
JPH11263818A1999-09-28
JP2001247743A2001-09-11
Attorney, Agent or Firm:
HARAKENZO WORLD PATENT & TRADEMARK (JP)
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