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Title:
CURABLE RESIN COMPOSITION CONTAINING POLYMER MICROPARTICLES
Document Type and Number:
WIPO Patent Application WO/2014/115778
Kind Code:
A1
Abstract:
A curable resin composition comprising (A) a curable resin having at least two polymerizable unsaturated bonds in the molecule and (B) polymer microparticles, and optionally comprising (C) an epoxy resin (C) and (D) a low-molecular-weight compound having at least one polymerizable unsaturated bond in the molecule and having a molecular weight of less than 300, said curable resin composition being characterized in that the content of the component (B) is 1 to 100 parts by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (D), the content of the epoxy resin (C) is less than 0.5 part by mass relative to the total amount, i.e., 100 parts by mass, of the components (A) and (D), the content of epoxy (meth)acrylate is less than 99 parts by mass relative to the total amount, i.e., 100 parts by mass, of the component (A), and the component (B) is dispersed in the curable resin composition in the form of primary particles.

Inventors:
HONGO SHINYA (US)
Application Number:
PCT/JP2014/051293
Publication Date:
July 31, 2014
Filing Date:
January 22, 2014
Export Citation:
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Assignee:
KANEKA NORTH AMERICA LLC (US)
KANEKA CORP (JP)
International Classes:
C08F290/06; C08F2/44; C08F283/01; C08F299/00
Domestic Patent References:
WO2010143366A12010-12-16
Foreign References:
JPH06192345A1994-07-12
JPH05230358A1993-09-07
JP2003327845A2003-11-19
JP2006262630A2006-09-28
JP2002284825A2002-10-03
JP2000017235A2000-01-18
Attorney, Agent or Firm:
YASUTOMI & Associates (JP)
Patent business corporation Yasutomi international patent firm (JP)
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