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Patent Searching and Data


Title:
PHOTO/MOISTURE CURABLE RESIN COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2020/149379
Kind Code:
A1
Abstract:
The present invention provides a photo/moisture curable resin composition which has good initial adhesive force. A photo/moisture curable resin composition according to the present invention contains a radically polymerizable compound, a moisture curable resin and a photopolymerization initiator; and the SP value difference between the radically polymerizable compound and the moisture curable resin is 1 or less.

Inventors:
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
Application Number:
PCT/JP2020/001369
Publication Date:
July 23, 2020
Filing Date:
January 16, 2020
Export Citation:
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Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F2/46; C08F2/50; C08G18/08; C08G18/10; C08G18/30; C09J4/06; C09J175/04
Domestic Patent References:
WO2015056717A12015-04-23
WO2017164200A12017-09-28
Foreign References:
JP2013018853A2013-01-31
JP2008133326A2008-06-12
JP2009197053A2009-09-03
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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