Title:
PHOTO/MOISTURE CURABLE RESIN COMPOSITION AND CURED BODY
Document Type and Number:
WIPO Patent Application WO/2020/149379
Kind Code:
A1
Abstract:
The present invention provides a photo/moisture curable resin composition which has good initial adhesive force. A photo/moisture curable resin composition according to the present invention contains a radically polymerizable compound, a moisture curable resin and a photopolymerization initiator; and the SP value difference between the radically polymerizable compound and the moisture curable resin is 1 or less.
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Inventors:
SHIOJIMA MOTOMI (JP)
KAWADA SHINJI (JP)
KAWADA SHINJI (JP)
Application Number:
PCT/JP2020/001369
Publication Date:
July 23, 2020
Filing Date:
January 16, 2020
Export Citation:
Assignee:
SEKISUI CHEMICAL CO LTD (JP)
International Classes:
C08F2/44; C08F2/46; C08F2/50; C08G18/08; C08G18/10; C08G18/30; C09J4/06; C09J175/04
Domestic Patent References:
WO2015056717A1 | 2015-04-23 | |||
WO2017164200A1 | 2017-09-28 |
Foreign References:
JP2013018853A | 2013-01-31 | |||
JP2008133326A | 2008-06-12 | |||
JP2009197053A | 2009-09-03 |
Attorney, Agent or Firm:
TAGUCHI, Masahiro et al. (JP)
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