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Title:
CURABLE RESIN COMPOSITION, CURED FILM, COATED RESIN MOLDED BODY AND MULTILAYER FILM
Document Type and Number:
WIPO Patent Application WO/2021/006290
Kind Code:
A1
Abstract:
The present invention enables the achievement of a resin composition which has both thermosetting properties and active energy ray-curable properties, while achieving good performance. Unlike conventional resin compositions, it is not necessary for this resin composition to worry about a short pot life after blending of a thermal crosslinking agent. Consequently, this resin composition has excellent properties including handling properties, while being obtained at low cost. A curable resin composition which is characterized by containing: (A) a resin component that contains (a) a (meth)acryloyl group, (b) a hydroxyl group and (c) an alkyl ester group; and (B) an initiator.

Inventors:
MORIWAKI YUYA (JP)
MATSUDA TOMOYA (JP)
ASADA KOSUKE (JP)
DONKAI MASARU (JP)
TAKENAKA NAOMI (JP)
NAKAGAWA HIROKI (JP)
Application Number:
PCT/JP2020/026678
Publication Date:
January 14, 2021
Filing Date:
July 08, 2020
Export Citation:
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Assignee:
KYOEISHA CHEMICAL CO LTD (JP)
International Classes:
B32B27/30; C08F290/00; C08F299/00; C09D4/02; C09D7/63
Domestic Patent References:
WO2016178345A12016-11-10
WO2012160891A12012-11-29
Foreign References:
JP2004177498A2004-06-24
JPH05509339A1993-12-22
JPH0715119A1995-01-17
JPH07173262A1995-07-11
CN110627961A2019-12-31
JP6398026B12018-09-26
Other References:
See also references of EP 3988301A4
Attorney, Agent or Firm:
TASS MEISTER PATENT FIRM (JP)
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