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Title:
CURABLE RESIN, CURABLE RESIN COMPOSITION, CURED PRODUCT, ELECTRONIC DEVICE, LAMINATED BOARD MATERIAL, ELECTRONIC COMPONENT ENCAPSULANT, AND METHOD FOR PRODUCING CURABLE RESIN
Document Type and Number:
WIPO Patent Application WO/2021/172319
Kind Code:
A1
Abstract:
A curable resin represented by general formula (1). In general formula (1), R1 each independently represent a monovalent substituent (alkyl group, alkoxy group, fluorine atom, etc.), m is 0-4, n is 0-40, and R2 each independently are a monovalent group including a polymerizable functional group.

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Inventors:
HIROTAKI KENSUKE (JP)
NAGURA HIROKATSU (JP)
HOSOI KENJI (JP)
HARA YUKARI (JP)
Application Number:
PCT/JP2021/006760
Publication Date:
September 02, 2021
Filing Date:
February 24, 2021
Export Citation:
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Assignee:
CENTRAL GLASS CO LTD (JP)
International Classes:
C08G59/06; C08G59/17; H01L23/29; H01L23/31
Foreign References:
JP2013010941A2013-01-17
JP2013155336A2013-08-15
JP2003040971A2003-02-13
JP2013155336A2013-08-15
JP2013155337A2013-08-15
JP2007246819A2007-09-27
JP2003040971A2003-02-13
JP2020033227A2020-03-05
Other References:
BULL. CHEM. SOC. JPN., vol. 74, 2001, pages 377 - 383
Attorney, Agent or Firm:
HAYAMI Shinji (JP)
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