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Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/170958
Kind Code:
A1
Abstract:
Provided are: a curable resin composition which is capable of providing a cured product that exhibits excellent crack resistance when a high temperature load is applied thereto; and the like. A curable resin composition which contains (A) an alkali-soluble resin, (B) a thermosetting component, (C) a compound having an ethylenically unsaturated group, (D) a photopolymerization initiator and (E) a surface-treated inorganic filler, and which is characterized in that: the inorganic filler (E) has an average particle diameter of 100 nm to 1 μm, and comprises a reactive group that is able to react with at least one of the alkali-soluble resin (A), the thermosetting component (B) and the compound (C) having an ethylenically unsaturated group; an epoxy resin having an epoxy equivalent weight of 300 g/eq. or less is contained as the thermosetting component (B); and with respect to a cured product obtained from the resin composition and having a thickness of 40 μm, the maximum value of Tan δ as determined by dynamic viscoelasticity measurement performed at a frequency of 1 Hz at a heating rate of 5°C/min from 25°C to 300°C is 0.15 or less.

Inventors:
UETA CHIHO (JP)
OKADA KAZUYA (JP)
ITO NOBUHITO (JP)
Application Number:
PCT/JP2017/013453
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/004; C08F2/50; G03F7/027; H05K3/28
Domestic Patent References:
WO2013022068A12013-02-14
Foreign References:
JP2014160271A2014-09-04
JP2013228722A2013-11-07
JP2014156601A2014-08-28
JP2011164270A2011-08-25
JP2016038587A2016-03-22
JP2016177174A2016-10-06
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
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