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Patent Searching and Data


Title:
CURABLE RESIN COMPOSITION, DRY FILM, CURED PRODUCT AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2017/170959
Kind Code:
A1
Abstract:
Provided are: a curable resin composition which is capable of providing a cured product that has excellent crack resistance and insulation reliability; a dry film which has a resin layer obtained from the composition; a cured product of the composition or the resin layer of the dry film; and a printed wiring board which comprises the cured product. A curable resin composition which is characterized by containing (A) a carboxyl group-containing resin and (B) an epoxy resin having a silsesquioxane skeleton; and the like.

Inventors:
OKADA KAZUYA (JP)
UETA CHIHO (JP)
YODA TAKESHI (JP)
ITO NOBUHITO (JP)
Application Number:
PCT/JP2017/013454
Publication Date:
October 05, 2017
Filing Date:
March 30, 2017
Export Citation:
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Assignee:
TAIYO INK MFG CO LTD (JP)
International Classes:
G03F7/075; C08F220/06; C08F220/28; C08F299/02; C08G8/30; C08G59/20; G03F7/004; G03F7/027; H05K3/28; C08G77/14
Domestic Patent References:
WO2011155613A12011-12-15
Foreign References:
JP2009126901A2009-06-11
JP2010106205A2010-05-13
JP2013541733A2013-11-14
JP2014081611A2014-05-08
JP2015227441A2015-12-17
JP2000281790A2000-10-10
JP2016160420A2016-09-05
Attorney, Agent or Firm:
HONDA ICHIRO (JP)
Ichiro Honda (JP)
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