Title:
CURABLE RESIN COMPOSITION, RESIN FILM, CURED FILM, LAMINATE, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE
Document Type and Number:
WIPO Patent Application WO/2021/157571
Kind Code:
A1
Abstract:
Provided are: a curable resin composition including at least two solvents and at least one resin selected from the group consisting of a polyimide, a polyimide precursor, a polybenzoxazole, and a polybenzoxazole precursor; a resin film obtained by applying the curable resin composition to a substrate; a cured film obtained by curing the curable resin composition; a laminate including the cured film; a method for producing the cured film; and a semiconductor device including the cured film or the laminate.
Inventors:
TAKASHIMA MISAKI (JP)
YAMAZAKI KENTA (JP)
MURAYAMA SATORU (JP)
INOUE KAZUOMI (JP)
YAMAZAKI KENTA (JP)
MURAYAMA SATORU (JP)
INOUE KAZUOMI (JP)
Application Number:
PCT/JP2021/003731
Publication Date:
August 12, 2021
Filing Date:
February 02, 2021
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
C08F290/14; C08G73/10; C08G73/22; C08K5/5415; C08L79/04; C08L79/08; C09D7/20; C09D7/63; C09D179/04; C09D179/08; G03F7/004; G03F7/027; G03F7/037; G03F7/075; G03F7/20; G03F7/26; G03F7/40; H01L21/768; H01L23/532
Domestic Patent References:
| WO2018151195A1 | 2018-08-23 | |||
| WO2018043467A1 | 2018-03-08 | |||
| WO2017038664A1 | 2017-03-09 | |||
| WO2017043474A1 | 2017-03-16 | |||
| WO2017170600A1 | 2017-10-05 | |||
| WO2016167038A1 | 2016-10-20 | |||
| WO2016017497A1 | 2016-02-04 |
Foreign References:
| JP2009091573A | 2009-04-30 | |||
| JP2013015701A | 2013-01-24 |
Attorney, Agent or Firm:
SIKS & CO. (JP)
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