Title:
CURABLE RESIN COMPOSITION, RESIN FILM, CURED OBJECT, AND LAYERED PRODUCT
Document Type and Number:
WIPO Patent Application WO/2021/210625
Kind Code:
A1
Abstract:
A curable resin composition which comprises a block polymer including a polyimide unit and a polymer unit of ethylenically unsaturated monomers, the units having been connected to each other by a residue of a chain-transfer agent, and a crosslinking agent, wherein the polymer unit includes a constituent unit derived from an ethylenically unsaturated monomer having one or more crosslinking groups in the molecule.
Inventors:
HOTA HIROHARU (JP)
OYA TORU (JP)
OYA TORU (JP)
Application Number:
PCT/JP2021/015524
Publication Date:
October 21, 2021
Filing Date:
April 15, 2021
Export Citation:
Assignee:
TOYO INK SC HOLDINGS CO LTD (JP)
TOYOCHEM CO LTD (JP)
TOYOCHEM CO LTD (JP)
International Classes:
B32B27/26; B32B27/34; C08F265/10; C08F293/00; C08G18/63; C08G59/42; C08G73/10; C08J5/16; C08J5/18; C08L51/08; C08L53/00; C08L63/00
Domestic Patent References:
| WO2018191954A1 | 2018-10-25 | |||
| WO2019130807A1 | 2019-07-04 |
Foreign References:
| JP2005320461A | 2005-11-17 | |||
| JP2003292568A | 2003-10-15 |
Attorney, Agent or Firm:
MIYOSHI Hidekazu et al. (JP)
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