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Title:
CURABLE RESIN COMPOSITION INCLUDING CROSSLINKABLE PARTICLES
Document Type and Number:
WIPO Patent Application WO/2016/199717
Kind Code:
A1
Abstract:
This curable resin composition includes: a resin component having ethylenically unsaturated groups; and crosslinkable particles obtained by bonding, to surfaces of base particles, polymer graft chains having ethylenically unsaturated groups. It is preferable that the density of the polymer graft chains on the surface of each of the base particles be 0.05-1.2 chains/nm2.

Inventors:
MURATA NAOKI (JP)
NAKAGAWA YASUHIRO (JP)
DOI MITSURU (JP)
OHNO KOHJI (JP)
Application Number:
PCT/JP2016/066754
Publication Date:
December 15, 2016
Filing Date:
June 06, 2016
Export Citation:
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Assignee:
SHOWA DENKO KK (JP)
International Classes:
C08F299/00; C08F290/00; C09J7/00; C09J11/00; C09J11/06; C09J11/08; C09J123/26; C09J133/00; C09J167/06; C09J175/14; C09J201/02
Domestic Patent References:
WO2005108451A12005-11-17
Foreign References:
JP2013040229A2013-02-28
JP2007238897A2007-09-20
JP2009046526A2009-03-05
JP2014047291A2014-03-17
JP2013199522A2013-10-03
JP2007191562A2007-08-02
Attorney, Agent or Firm:
SHIGA Masatake et al. (JP)
Masatake Shiga (JP)
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