Title:
CURABLE RESIN COMPOSITION, PREPREG, METAL-CLAD LAMINATE, AND PRINTED WIRING BOARD
Document Type and Number:
WIPO Patent Application WO/2021/166649
Kind Code:
A1
Abstract:
The present invention provides: a curable resin composition with which it is possible to provide a molded article or a cured product having improved heat resistance, compatibility, dielectric characteristics, hygrothermal reliability, and thermal oxidation degradation resistance; a film generated from said resin composition; a curable composite material; a laminate; and a resin-equipped copper foil. A curable resin composition characterized by containing: (A) a soluble polyfunctional vinyl aromatic copolymer that contains a repeating unit (a1) derived from a divinyl aromatic compound and a repeating unit (a2) derived from a monovinyl aromatic compound, that contains 2-80 mol% of an unsaturated hydrocarbon group represented by formula (a1-1) with respect to the total of (a1) and (a2), that has an Mn of 300-100,000, and that is soluble to an organic solvent such as toluene; and (B) a specific phosphorus-containing compound. [Chem. 1] In the formula, R1 represents an aromatic hydrocarbon group having 6-30 carbon atoms.
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| JPH0624810 | [Title of Invention] Laminated Plate |
Inventors:
IWASHITA SHINICHI (JP)
KAWABE MASANAO (JP)
KAWABE MASANAO (JP)
Application Number:
PCT/JP2021/003931
Publication Date:
August 26, 2021
Filing Date:
February 03, 2021
Export Citation:
Assignee:
NIPPON STEEL CHEMICAL & MAT CO LTD (JP)
International Classes:
C08F299/00; B32B15/082; C08F212/02; C08F212/34; C08J5/24; C08K5/49; C08L25/02; H05K1/03
Domestic Patent References:
| WO2017059653A1 | 2017-04-13 |
Foreign References:
| JP2006274169A | 2006-10-12 | |||
| JP2008248001A | 2008-10-16 | |||
| JP2001270993A | 2001-10-02 | |||
| CN107227015A | 2017-10-03 | |||
| US20180086870A1 | 2018-03-29 | |||
| US20170342185A1 | 2017-11-30 | |||
| JP2020105352A | 2020-07-09 |
Attorney, Agent or Firm:
SASAKI Kazuya et al. (JP)
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