CURABLE RESIN COMPOSITION

WIPO Patent Application WO/2006/059750

A1

Disclosed is a curable resin composition which enables to obtain a cured product having low dielectric loss tangent and excellent adhesion strength to a conductor body. Specifically disclosed is a curable resin composition containing a curable polyvinylbenzyl compound (A) and a modified styrene elastomer (B) having one or more functional groups selected from the group consisting of hydroxyl groups, carboxyl groups, amino groups and acid anhydride groups. A dielectric powder (C) is easily dispersed in the composition, and a cured product having high dielectric constant can be obtained from a composition containing the dielectric powder (C). By curing the composition, there can be obtained an insulating layer suitable for electric circuits.

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TAKADA MOTOYUKI (JP)
HAYASHI EIICHI (JP)

PCT/JP2005/022246

June 08, 2006

November 29, 2005

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AJINOMOTO KK (JP)
TAKADA MOTOYUKI (JP)
HAYASHI EIICHI (JP)

C08L25/00; C08F257/00; C08F299/00; C08J5/24; C08L65/00; H01B3/00; H01B3/28; H01B3/44; H01L21/60; H05K3/46

JP2005041914A	2005-02-17
JP2003277440A	2003-10-02
JP2004059741A	2004-02-26
JP2003099952A	2003-04-04
JPH065660A	1994-01-14
JP2002128977A	2002-05-09
JP2004087639A	2004-03-18

Takashima, Hajime (1-1, Fushimimachi 4-chome, Chuo-k, Osaka-shi Osaka 44, JP)

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