Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/217676
Kind Code:
A1
Abstract:
Provided are a curable resin composition, the cured product of which is endowed with excellent heat resistance and dielectric properties, a cured product of the curable resin composition, and a prepreg, a circuit board, a build-up film semiconductor sealing material, and a semiconductor device endowed with such performance. The curable resin composition of the present invention is characterized by containing a maleimide having an indane skeleton (A), a polyphenylene ether compound (B), and an epoxy resin (C).
Inventors:
SHIMONO TOMOHIRO (JP)
OKAMOTO TATSUYA (JP)
OKAMOTO TATSUYA (JP)
Application Number:
PCT/JP2020/006786
Publication Date:
October 29, 2020
Filing Date:
February 20, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F22/40; B32B15/08; B32B15/088; C08G59/62; C08J5/24; C08L63/00; C08L71/12; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| WO1993012933A1 | 1993-07-08 |
Foreign References:
| JP2009084391A | 2009-04-23 | |||
| JPH0347814A | 1991-02-28 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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