Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2020/217678
Kind Code:
A1
Abstract:
Provided are: a curable resin composition which gives cured objects combining excellent heat resistance with dielectric properties; a cured object obtained from the curable resin composition; a prepreg which attains these performances; a circuit board; a build-up film; a semiconductor encapsulant; and a semiconductor device. The curable resin composition of the present invention is characterized by comprising a maleimide (A) having an indane skeleton and a diene-based polymer (B).
Inventors:
SHIMONO TOMOHIRO (JP)
OKAMOTO TATSUYA (JP)
OKAMOTO TATSUYA (JP)
Application Number:
PCT/JP2020/006816
Publication Date:
October 29, 2020
Filing Date:
February 20, 2020
Export Citation:
Assignee:
DAINIPPON INK & CHEMICALS (JP)
International Classes:
C08F279/02; B32B15/08; B32B15/088; C08F22/40; C08J5/24; H01L23/29; H01L23/31; H05K1/03
Domestic Patent References:
| WO1993012933A1 | 1993-07-08 |
Foreign References:
| JP2009035710A | 2009-02-19 | |||
| JPS6426555A | 1989-01-27 | |||
| JPS63275562A | 1988-11-14 | |||
| JP2018012671A | 2018-01-25 |
Attorney, Agent or Firm:
UNIUS PATENT ATTORNEYS OFFICE (JP)
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