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Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/286700
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a UV/heat-curing type curable resin composition which exhibits sufficiently high adhesion strength even after having only undergone either a UV-curing treatment or a heat-curing treatment. This curable resin composition comprises the following (A) to (F): (A) a polyfunctional (meth)acrylate compound, (B) a monofunctional (meth)acrylate compound having a molecular weight of 400 or less, (C) an epoxy resin, (D) a polyfunctional thiol compound, (E) a radical photopolymerization initiator, and (F) a heat-curing accelerator. The total number (total amount) of (meth)acryloyl groups contained in the polyfunctional (meth)acrylate compound (A), the total number (total amount) of (meth)acryloyl groups contained in the monofunctional (meth)acrylate compound (B), the total number (total amount) of epoxy groups contained in the epoxy resin (C), and the total number (total amount) of thiol groups contained in the polyfunctional thiol compound (D) satisfy a given relationship.

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Inventors:
OTSUBO KODAI (JP)
SUZUKI FUMIYA (JP)
SAKATA YOKO (JP)
Application Number:
PCT/JP2022/027060
Publication Date:
January 19, 2023
Filing Date:
July 08, 2022
Export Citation:
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Assignee:
NAMICS CORP (JP)
International Classes:
C08G75/045; C08G59/66; C09J4/02; C09J11/06; C09J163/00
Domestic Patent References:
WO2012147712A12012-11-01
WO2018155013A12018-08-30
WO2012164869A12012-12-06
WO2016114268A12016-07-21
WO2018181421A12018-10-04
Foreign References:
JP2021075698A2021-05-20
JP2017210475A2017-11-30
JP2003302759A2003-10-24
JP2014141621A2014-08-07
JP2013043902A2013-03-04
JP2014077024A2014-05-01
JP2012153794A2012-08-16
JP2021116459A2021-08-10
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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