Title:
CURABLE RESIN COMPOSITION
Document Type and Number:
WIPO Patent Application WO/2023/286701
Kind Code:
A1
Abstract:
The present invention addresses the problem of providing a curable resin composition which exhibits high curability even when subjected only to a heat-curing treatment and comes to have moderate flexibility and stretchability through a UV-curing treatment and a subsequent heat-curing treatment, and which gives cured objects having higher impact-absorbing ability than cured objects obtained from conventional adhesives of a UV/heat curing type. This curable resin composition comprises the following (A) to (E): (A) a urethane compound containing (meth)acryloyl groups, (B) a (meth)acrylate compound containing no urethane bond, (C) a polyfunctional thiol compound, (D) a radical photopolymerization initiator, and (E) a heat-curing accelerator. The total number (total amount) of (meth)acryloyl groups contained in the urethane compound (A) containing methacryloyl groups, the total number (total amount) of (meth)acryloyl groups contained in the (meth)acrylate compound (B) containing no urethane bond, and the total number (total amount) of thiol groups contained in the polyfunctional thiol compound (C) satisfy a given relationship.
Inventors:
OTSUBO KODAI (JP)
SUZUKI FUMIYA (JP)
SAKATA YOKO (JP)
SUZUKI FUMIYA (JP)
SAKATA YOKO (JP)
Application Number:
PCT/JP2022/027061
Publication Date:
January 19, 2023
Filing Date:
July 08, 2022
Export Citation:
Assignee:
NAMICS CORP (JP)
International Classes:
C08F290/06; C08G18/67; C08G59/66; C08G75/045; C09J4/02; C09J11/06; C09J163/00; C09J175/14
Domestic Patent References:
| WO2018181421A1 | 2018-10-04 |
Foreign References:
| JP2017101112A | 2017-06-08 | |||
| JP2018095829A | 2018-06-21 | |||
| JP2016169266A | 2016-09-23 | |||
| JP2015205943A | 2015-11-19 | |||
| JP2014077024A | 2014-05-01 | |||
| JP2012153794A | 2012-08-16 | |||
| JP2021116461A | 2021-08-10 |
Attorney, Agent or Firm:
TSUKUNI & ASSOCIATES et al. (JP)
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