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Title:
CURABLE SILICONE COMPOSITION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2020/138409
Kind Code:
A1
Abstract:
[Problem] To provide a curable granular silicone composition which has hot-melt properties, and which provides a cured product obtained through overmolding or the like having particularly excellent flexibility and toughness in a temperature range from room temperature to a high temperature of about 150°C, and also provides a cured product that is not easily bent or damaged even when integrally molded with an aluminum lead frame, etc. [Solution] Provided are a curable granular silicone composition and a use thereof, said composition being characterized by comprising: (A) organopolysiloxane resin fine particles having a curing-reactive functional group; (B) a functional inorganic filler; and (C) a curing agent, wherein by using said composition, a cured product is obtained which has a storage elastic modulus of 2000 MPa or less and 100 MPa or less at 25°C and 150°C, respectively, and which has a peak value of tanδ of 0.40 or more as represented by storage elastic modulus/loss elastic modulus (G'/G").

Inventors:
YAMAZAKI RYOSUKE (JP)
Application Number:
PCT/JP2019/051392
Publication Date:
July 02, 2020
Filing Date:
December 27, 2019
Export Citation:
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Assignee:
DOW TORAY CO LTD (JP)
International Classes:
C08L83/04; C08J5/00; C08K3/01; H01L21/56; H01L23/29; H01L23/31
Domestic Patent References:
WO2018030287A12018-02-15
WO2018030286A12018-02-15
WO2016136243A12016-09-01
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