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Patent Searching and Data


Title:
CURING COMPOSITION HAVING MOLD RELEASABILITY
Document Type and Number:
WIPO Patent Application WO/2005/000928
Kind Code:
A1
Abstract:
Disclosed is a curing composition containing the following three components: (A) a vinyl polymer (I) containing at least one group represented by the general formula (1) below at the end of the molecule: CH2=C(Ra)-C(O)O- (1) (wherein Ra represents a hydrogen or a monovalent organic group having 1-20 carbon atoms); (B) a polymerization initiator; and (C) a metal soap. The curing composition contains a vinyl polymer and has excellent mold releasability while scarcely deteriorating mechanical properties such as compression set.

Inventors:
OKADA KENJI (JP)
KOTANI JUN (JP)
NAKAGAWA YOSHIKI (JP)
Application Number:
PCT/JP2004/008966
Publication Date:
January 06, 2005
Filing Date:
June 18, 2004
Export Citation:
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Assignee:
KANEKA CORP (JP)
OKADA KENJI (JP)
KOTANI JUN (JP)
NAKAGAWA YOSHIKI (JP)
International Classes:
C08F299/00; (IPC1-7): C08F299/00
Domestic Patent References:
WO1999065963A11999-12-23
Foreign References:
Other References:
See also references of EP 1640392A4
Attorney, Agent or Firm:
KANEKA CORPORATION (Kita-ku Osaka-shi, Osaka, JP)
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