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Patent Searching and Data


Title:
CUSHIONING MATERIAL FOR PRESS MOLDING AND METHOD FOR PRODUCING SAME
Document Type and Number:
WIPO Patent Application WO/2006/035634
Kind Code:
A1
Abstract:
Disclosed is a cushioning material comprising a cushioning layer (13) and a surface layer (12c) which is composed of a non-thermoplastic polyimide film and integrally bonded onto the cushioning layer (13) without having an adhesive layer between them. The non-thermoplastic polyimide film (12c) is obtained by heating and imidating a polyamic acid film (12b) which has been integrally bonded onto the cushioning layer (13) without using an adhesive.

Inventors:
YOSHIDA AKIRA (JP)
Application Number:
PCT/JP2005/017279
Publication Date:
April 06, 2006
Filing Date:
September 20, 2005
Export Citation:
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Assignee:
YAMAUCHI CORP (JP)
YOSHIDA AKIRA (JP)
International Classes:
B29C43/32; B29C43/02; B29C65/48; B32B5/02; B32B27/34; B29L9/00
Foreign References:
JPH09182998A1997-07-15
JPH05156047A1993-06-22
JPH101644A1998-01-06
JP2002326302A2002-11-12
Attorney, Agent or Firm:
Itoh, Hidehiko (Kyowa Shimanouchi Bldg. 21-19, Shimanouchi 1-chome, Chuo-k, Osaka-shi Osaka 82, JP)
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