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Title:
CUTTER WHEEL FOR CUTTING FLEXIBLE GLASS SUBSTRATE, AND CUTTING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2019/080264
Kind Code:
A1
Abstract:
Disclosed are a cutter wheel for cutting a flexible glass substrate, and a cutting method therefor. The cutter wheel (403, 505) comprises: a first disc face (101, 201, 301) and a second disc face (102, 302); a circumferential cutting edge (103) formed by the first disc face (101, 201, 301) and the second disc face (102, 302) extending outwards and meeting each other; a central shaft hole (104, 202, 503); a hollow region (105, 504) connected to the central shaft hole (104, 202, 503); and a groove (106, 205, 506) distributed on the circumferential cutting edge (103) and in communication with the hollow region (105, 504). The hollow region (105, 504) is of a double-tapered structure, and the interior of the cutter wheel (403, 505) can be cleaned.

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Inventors:
DU XIAO (CN)
Application Number:
PCT/CN2017/114523
Publication Date:
May 02, 2019
Filing Date:
December 05, 2017
Export Citation:
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Assignee:
WUHAN CHINA STAR OPTOELECTRONICS SEMICONDUCTOR DISPLAY TECH CO LTD (CN)
International Classes:
B26D1/00; B26D1/14; B26D7/08; B28D5/00; C03B33/10
Domestic Patent References:
WO2009034759A12009-03-19
Foreign References:
CN105036536A2015-11-11
CN202415372U2012-09-05
CN101143761A2008-03-19
CN105084752A2015-11-25
CN103288343A2013-09-11
JP2009234874A2009-10-15
Attorney, Agent or Firm:
ESSEN PATENT&TRADEMARK AGENCY (CN)
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