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Patent Searching and Data


Title:
CUTTING APPARATUS
Document Type and Number:
WIPO Patent Application WO/2022/142433
Kind Code:
A1
Abstract:
The present disclosure provides a cutting apparatus, used for cutting a crucible. The cutting apparatus comprises: a gripper device, a locating device, and a cutting device; wherein the gripper device holds the crucible, the locating device works in conjunction with the gripper device to perform a locating operation on the crucible to cause the centerline of the crucible to coincide with the centerline of the gripper device, the cutting device is disposed opposite to the gripper device, and the cutting device is used for machining the crucible held by the gripper device. The cutting apparatus in the present disclosure has characteristics of fast locating speed and good machining effect.

Inventors:
DENG SHUZHEN (CN)
YANG LINKUI (CN)
LIU AIJUN (CN)
CHEN XINJUN (CN)
NIU JINMIAO (CN)
LI GUOMAN (CN)
NIE DAWEI (CN)
HU XINLIN (CN)
Application Number:
PCT/CN2021/116062
Publication Date:
July 07, 2022
Filing Date:
September 01, 2021
Export Citation:
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Assignee:
BAOSHAN LONGI SILICON MAT CO LTD (CN)
International Classes:
B28D1/00; B24B9/06; B24B27/00; B28D1/16
Foreign References:
CN201841608U2011-05-25
CN209477456U2019-10-11
CN205130144U2016-04-06
CN208084015U2018-11-13
CN202592185U2012-12-12
CN204935925U2016-01-06
JP2001226134A2001-08-21
Attorney, Agent or Firm:
BEIJING RUN ZEHENG INTELLECTUAL PROPERTY LAW FIRM (CN)
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