CUTTING DEVICE OF SILICON ROD CUTTING SYSTEM AND SILICON ROD CUTTING SYSTEM

WIPO Patent Application WO/2023/072127

A1

A cutting device (4) of a silicon rod cutting system and the silicon rod cutting system. The cutting device (4) comprises: a support frame (44), mounted on a machine base (1) of the silicon rod cutting system; two cutting machine head mechanisms (41), the cutting machine head mechanisms (41) being provided with diamond wires, and cutting sections of the diamond wires being used for cutting a silicon rod from top to bottom during moving; and a feeding machine, the support frame (44) being connected to the two cutting machine head mechanisms (41) by means of the feeding mechanism, and the two cutting sections being oppositely arranged, wherein the feeding mechanism is used to drive the two cutting machine head mechanisms (41) to move towards and away from each other so as to adjust the distance between the two cutting sections, and is also used to drive the two cutting machine head mechanisms (41) to move up and down in the vertical direction so as to cut and reset a vertically arranged silicon rod. The cutting device (4) is suitable for vertical cutting of silicon rods with various diameters, and is high in universality. A cutting system comprising the cutting device (4) is further involved.

HOU SHENGEN (CN)
ZHOU CONG (CN)
LIU KECUN (CN)
FAN CHANGKUN (CN)
SUN PENG (CN)
GUO SHIFENG (CN)

PCT/CN2022/127599

May 04, 2023

October 26, 2022

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QINGDAO GAOCE TECH CO LTD (CN)

B28D5/00; B28D5/04

CN113997436A	2022-02-01
CN114102889A	2022-03-01
CN111619026A	2020-09-04
CN209381175U	2019-09-13
CN112157832A	2021-01-01
CN212578936U	2021-02-23
CN211164736U	2020-08-04
JP2011046043A	2011-03-10

QINGDAO LZ PATENT&TRADEMARK OFFICE CO., LTD. (CN)

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