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Patent Searching and Data


Title:
CUTTING FLUID FOR CHAMFERING
Document Type and Number:
WIPO Patent Application WO/2021/051297
Kind Code:
A1
Abstract:
Example of a cutting fluid (106) for chamfering(103) is described. In an example, a cutting fluid (106) includes at least one silicate in an amount of from about 0.5 wt% to about 3.0 wt% based on the total weight of the cutting fluid (106); at least one base in an amount of from about 1.0 wt% to about 5.0 wt% based on the total weight of the cutting fluid (106); and at least one phosphate in an amount of from about 0.5 wt% to about 2.0 wt% based on the total weight of the cutting fluid (106), wherein the cutting fluid (106) has a pH of from about 9 to about 13.

Inventors:
GUO QINGYONG (CN)
XU YONGYONG (CN)
CHUANG YACHENG (CN)
WU KUAN-TING (CN)
Application Number:
PCT/CN2019/106350
Publication Date:
March 25, 2021
Filing Date:
September 18, 2019
Export Citation:
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Assignee:
HEWLETT PACKARD DEVELOPMENT CO (US)
GUO QINGYONG (CN)
XU YONGYONG (CN)
CHUANG YACHENG (CN)
WU KUAN TING (CN)
International Classes:
C10M173/00; B23C3/12; C10M169/04
Foreign References:
CN104498164A2015-04-08
CN104498164A2015-04-08
CN110248753A2019-09-17
CN102732363A2012-10-17
CN101870909A2010-10-27
CN101560433A2009-10-21
JP2011241293A2011-12-01
Attorney, Agent or Firm:
CHINA PATENT AGENT (H.K.) LTD. (CN)
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