DEFOAMING METHOD AND DEVICE - TOYO SEIKAN KAISHA LTD

Title:

DEFOAMING METHOD AND DEVICE

Document Type and Number:

WIPO Patent Application WO/2011/052496

Kind Code:

A1

Abstract:

Provided are a defoaming method and device that use laser-induced breakdown. The provided method and device make it possible to shorten the focal distance, thereby improving laser light convergence, and increase the utilization efficiency of sound waves that contribute to defoaming. Pulsed laser light is focused and shined into a space inside an acoustic waveguide (4), thereby generating pulsed sound waves from the illumination point (7). The pulsed sound waves propagate down the acoustic waveguide as planar waves, then propagate beyond an open end (16) as spherical waves, and break up a foam outside the open end of the acoustic waveguide.

Inventors:

TAKENOUCHI KEN (JP)

Application Number:

PCT/JP2010/068676

Publication Date:

May 05, 2011

Filing Date:

October 22, 2010

Export Citation:

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Assignee:

TOYO SEIKAN KAISHA LTD (JP)
TAKENOUCHI KEN (JP)

International Classes:

B01D19/02; B65B3/22; H01S3/00

Domestic Patent References:

WO2007086339A1

2007-08-02

Foreign References:

JPS63252509A	1988-10-19
JP2002520226A	2002-07-09
JPS53102178U	1978-08-17
JPS6031306U	1985-03-02
JPS63104620A	1988-05-10
JPS63252509A	1988-10-19
JPH1190330A	1999-04-06
JPH07291395A	1995-11-07
JPH09328193A	1997-12-22
JPS6290397A	1987-04-24
JPH06191595A	1994-07-12
JP2002520226A	2002-07-09
JP2007086339A	2007-04-05

Other References: