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Title:
DEVICE FOR AFFIXING WAFER TO SINGLE-SIDE POLISHING DEVICE, AND METHOD FOR AFFIXING WAFER TO SINGLE-SIDE POLISHING DEVICE
Document Type and Number:
WIPO Patent Application WO/2019/078009
Kind Code:
A1
Abstract:
A device (2) for affixing a wafer (W) to a single-side polishing device (1), wherein the device (2) affixes the wafer to the single-side polishing device by means of surface tension of water, is provided with: a temporary cradle (21) which supports the wafer (W) by coming into contact with the wafer (W) at an outer circumferential edge thereof; and a water discharge tank (22) which is provided on the temporary cradle (21) and discharges water onto the wafer (W).

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Inventors:
YAMAMOTO KATSUTOSHI (JP)
Application Number:
PCT/JP2018/037125
Publication Date:
April 25, 2019
Filing Date:
October 03, 2018
Export Citation:
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Assignee:
SUMCO CORP (JP)
International Classes:
B24B37/30; H01L21/304; H01L21/683
Foreign References:
JPH09115989A1997-05-02
JP2003109926A2003-04-11
JPH05102114A1993-04-23
JPH10337656A1998-12-22
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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