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Title:
DEVICE FOR PROCESSING SUBSTRATE, RAW MATERIAL CARTRIDGE, METHOD FOR PROCESSING SUBSTRATE, AND METHOD FOR PRODUCING RAW MATERIAL CARTRIDGE
Document Type and Number:
WIPO Patent Application WO/2021/090724
Kind Code:
A1
Abstract:
This device for processing a substrate for producing a semiconductor device comprises a processing gas supply unit configured to supply processing gas to a chamber accommodating the substrate. The processing gas supply unit has: a raw material cartridge including a raw material tank accommodating a porous member containing a metal-organic structure on which gas molecules of a raw material of the processing gas are adsorbed; a body unit configured to provide communication between the raw material tank and a processing gas supply channel when the raw material cartridge is attached; and a desorption mechanism configured to cause the gas molecules of the raw material adsorbed on the metal-organic structure to be desorbed and discharged as processing gas into the processing gas supply channel.

Inventors:
HARADA MUNEO (JP)
OKABE TSUNEYUKI (JP)
Application Number:
PCT/JP2020/040118
Publication Date:
May 14, 2021
Filing Date:
October 26, 2020
Export Citation:
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Assignee:
TOKYO ELECTRON LTD (JP)
International Classes:
B01J4/00; B01J7/00; B01J20/22; B01J20/34; C07C63/28; C07C63/307; C07C63/331; C07F1/08; C07F5/00; C07F11/00; C07F15/02; C23C16/34; C23C16/448; H01L21/285
Foreign References:
JP2003282556A2003-10-03
US20150176119A12015-06-25
JP2016191140A2016-11-10
US20180158687A12018-06-07
JP2019048294A2019-03-28
JP2019507903A2019-03-22
JP2010280991A2010-12-16
Attorney, Agent or Firm:
YAYOY PATENT OFFICE (JP)
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