Title:
DIAMOND CRYSTAL POLISHING METHOD AND DIAMOND CRYSTAL
Document Type and Number:
WIPO Patent Application WO/2019/177092
Kind Code:
A1
Abstract:
[Problem] To achieve: a diamond crystal polishing method capable of removing a process-modified section including dislocations from a main surface; and a diamond crystal in which the same process defect section has been removed from a main surface. [Solution] According to the present invention, a diamond crystal having a main surface oriented in the (100) plane is prepared, and next, when machine polishing the main surface of the diamond crystal, the tangent line direction at the contact point of the diamond crystal and a rotating polishing wheel in the rotation direction of the polishing wheel is set within ±10° of the <110> direction of the diamond crystal. Through the machine polishing, an additional process-modified section is formed parallel to the (111) plane orientation of the diamond crystal and passing through on the main surface of the diamond crystal. Subsequently, CMP is performed on the main surface of the diamond crystal, and the process defect section formed parallel to the (111) plane orientation is removed to remove the process-modified section from the main surface.
Inventors:
KIM SEONGWOO (JP)
FUJII DAIKI (JP)
OYAMA KOKI (JP)
KOYAMA KOJI (JP)
FUJII DAIKI (JP)
OYAMA KOKI (JP)
KOYAMA KOJI (JP)
Application Number:
PCT/JP2019/010524
Publication Date:
September 19, 2019
Filing Date:
March 14, 2019
Export Citation:
Assignee:
ADAMANT NAMIKI PREC JEWEL CO LTD (JP)
International Classes:
B24B1/00; B24B7/22; B24B37/10; C01B32/28; C30B29/04; C30B33/00; H01L21/304
Domestic Patent References:
| WO2015046294A1 | 2015-04-02 |
Foreign References:
| JP2015179830A | 2015-10-08 | |||
| JPH05148088A | 1993-06-15 | |||
| JP2010058204A | 2010-03-18 | |||
| JP2009518273A | 2009-05-07 |
Other References:
See also references of EP 3766634A4
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