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Title:
DIAMOND CUTTING TOOL AND PRODUCTION METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/079586
Kind Code:
A1
Abstract:
This diamond cutting tool includes a blade tip portion comprising graphite and a single crystal diamond or a binderless polycrystalline diamond. When Raman spectroscopy is performed on the surface of the blade tip portion, the ratio R1 of the peak intensity Ig1 for second carbon on the surface to the sum of the peak intensity Id1 for first carbon on the surface and Ig1 is between 0.5 and 1 inclusive, the first carbon representing carbon constituting the single crystal diamond or the binderless polycrystalline diamond and the second carbon representing carbon constituting the graphite. When Raman spectroscopy is performed in a plane located at a depth of 1 μm from the surface, the ratio R2 of the peak intensity Ig2 for the second carbon in the plane located at the depth of 1 μm from the surface to the sum of the peak intensity Id2 for the first carbon in the plane located at the depth of 1 μm from the surface and Ig2 is between 0.01 and 0.3 inclusive.

Inventors:
UEDA AKIHIKO (JP)
WATANOBE NAOKI (JP)
KUKINO SATORU (JP)
Application Number:
PCT/JP2020/029738
Publication Date:
April 29, 2021
Filing Date:
August 04, 2020
Export Citation:
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Assignee:
SUMITOMO ELECTRIC HARDMETAL CORP (JP)
International Classes:
B23B27/14; B23B27/20; B23P15/28; B28D5/00; C01B32/205; C01B32/28; C04B35/52; C04B41/91; C30B29/04
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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