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Patent Searching and Data


Title:
DICING-DIE BONDING INTEGRATED FILM AND TACKIFIER FILM USED FOR SAME
Document Type and Number:
WIPO Patent Application WO/2019/240234
Kind Code:
A1
Abstract:
A dicing-die bonding integrated film according to an aspect of the present disclosure has a structure in which at least a substrate layer, a tackifier layer, and an adhesive layer are sequentially laminated, wherein the tackifier layer contains a photopolymerization component and a photopolymerization initiator (D). The photopolymerization component contains a structural unit derived from a polymer (A) having a group containing a quaternary ammonium salt and a hydroxyl group, an energy-curable tackifier component (B) having a hydroxyl group, and a thermal crosslinking agent (C), wherein the structural unit is at least one of a structural unit in which the polymer (A) and the tackifier component (B) are linked via the thermal crosslinking agent (C) or a structural unit in which the tackifier component (B) is linked via the thermal crosslinking agent (C).

Inventors:
KIMURA NAOHIRO (JP)
OHKUBO KEISUKE (JP)
YAMANAKA DAISUKE (JP)
Application Number:
PCT/JP2019/023557
Publication Date:
December 19, 2019
Filing Date:
June 13, 2019
Export Citation:
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Assignee:
HITACHI CHEMICAL CO LTD (JP)
International Classes:
C09J7/38; C09J11/06; C09J201/02; C09J201/06; H01L21/301
Domestic Patent References:
WO2016140163A12016-09-09
Foreign References:
JP2017163147A2017-09-14
JP2014133858A2014-07-24
JP2017092365A2017-05-25
JP2015140341A2015-08-03
Attorney, Agent or Firm:
HASEGAWA Yoshiki et al. (JP)
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