Title:
DIE COMPONENT SUPPLY DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/105032
Kind Code:
A1
Abstract:
A die component supply device (1) is provided with: a wafer holding unit (2) which includes an expandable component holding sheet (23) holding on an upper surface thereof a plurality of die components (D) formed by dicing a semiconductor wafer, and a support ring (22) supporting the periphery of the component holding sheet; a suction-attraction nozzle (5) which suction-attracts the die components one by one from the component holding sheet; an image-capture camera (6) which captures an image of the die components before being suction-attracted by the suction-attraction nozzle, together with a surrounding situation, to acquire component image data; a drive unit (4) which causes the suction-attraction nozzle and the image-capture camera to be moved relative to the wafer holding unit; and a data processing storage unit (87) which integrates a plurality of items of component image data respectively acquired in correspondence to the plurality of die components, or a plurality of items of component characteristics data respectively obtained by image-processing the plurality of items of component image data, into wafer characteristics data (88) to be stored therein.
Inventors:
HAYAKAWA MASASHI (JP)
Application Number:
PCT/JP2016/086149
Publication Date:
June 14, 2018
Filing Date:
December 06, 2016
Export Citation:
Assignee:
FUJI CORP (JP)
International Classes:
H01L21/67
Domestic Patent References:
WO2016157356A1 | 2016-10-06 |
Foreign References:
JP2013197225A | 2013-09-30 | |||
JP2013004794A | 2013-01-07 | |||
JP2011061069A | 2011-03-24 |
Other References:
See also references of EP 3553813A4
Attorney, Agent or Firm:
KOBAYASHI Osamu et al. (JP)
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