Title:
DIE DEVICE
Document Type and Number:
WIPO Patent Application WO/2018/025650
Kind Code:
A1
Abstract:
This die device is provided with: a first single crystal diamond die having a first bearing; and a second diamond die which is adjacent to the first single crystal diamond die, is fixed in position relative to the first single crystal diamond die, has a second bearing, and is positioned further downstream than the first bearing. The uneven wear profile of the first bearing is different from the uneven wear profile of the second bearing.
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Inventors:
YUKAWA MAKOTO (JP)
SUEMITSU BUNYA (JP)
SUEMITSU BUNYA (JP)
Application Number:
PCT/JP2017/026312
Publication Date:
February 08, 2018
Filing Date:
July 20, 2017
Export Citation:
Assignee:
ALMT CORP (JP)
International Classes:
B21C3/12
Foreign References:
| JP2005046899A | 2005-02-24 | |||
| JPS6352710A | 1988-03-05 | |||
| JP2010149139A | 2010-07-08 | |||
| JP2008238210A | 2008-10-09 |
Attorney, Agent or Firm:
FUKAMI PATENT OFFICE, P.C. (JP)
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