Title:
DIE HEAD
Document Type and Number:
WIPO Patent Application WO/2021/065579
Kind Code:
A1
Abstract:
Provided is a die head, which has: two or more lips disposed in a row and a slot for transferring and discharging coating liquid, the slot being formed between adjacent lips. The land surface of one of the lips at one end in the direction of the row and/or the outer surface of another lip at the other end in the direction of the row, the outer surface being on the side opposite the slot-forming surface of the lip and joining with the land surface, forms a dynamic contact angle hysteresis of 20° or less, which is provided by methyl ethyl ketone.
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Inventors:
KUNIYASU SATOSHI (JP)
Application Number:
PCT/JP2020/035541
Publication Date:
April 08, 2021
Filing Date:
September 18, 2020
Export Citation:
Assignee:
FUJIFILM CORP (JP)
International Classes:
B05C5/02
Foreign References:
| JP2011507700A | 2011-03-10 | |||
| JP2011235452A | 2011-11-24 | |||
| JP2014026107A | 2014-02-06 | |||
| JP2018183762A | 2018-11-22 | |||
| JP2018193548A | 2018-12-06 | |||
| JPH091028A | 1997-01-07 | |||
| JP2002248399A | 2002-09-03 |
Attorney, Agent or Firm:
TAIYO, NAKAJIMA & KATO (JP)
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