Title:
DIELECTRIC HEATING ADHESIVE FILM AND ADHESION METHOD USING DIELECTRIC HEATING ADHESIVE FILM
Document Type and Number:
WIPO Patent Application WO/2018/147351
Kind Code:
A1
Abstract:
A dielectric heating adhesive film for adhesion of a plurality of adherends comprising the same material or different materials, by dielectric heating. The dielectric heating adhesive film is characterized by: containing a thermoplastic resin as a component A and a dielectric filler as component B; the component A including at least one type of resin selected from the group consisting of an olefin–vinyl acetate copolymer and a maleic anhydride modified polyolefin; and the olefin–vinyl acetate copolymer including at least 2% by mass of a constituent unit derived from vinyl acetate.
Inventors:
TAYA NAOKI (JP)
ISHIKAWA MASAKAZU (JP)
ISHIKAWA MASAKAZU (JP)
Application Number:
PCT/JP2018/004305
Publication Date:
August 16, 2018
Filing Date:
February 08, 2018
Export Citation:
Assignee:
LINTEC CORP (JP)
International Classes:
C09J7/00; C09J5/06; C09J11/04; C09J123/00; C09J123/26; C09J131/04
Foreign References:
| JPS54161645A | 1979-12-21 | |||
| JPS61171783A | 1986-08-02 | |||
| JPS5268273A | 1977-06-06 | |||
| JPS6239221A | 1987-02-20 | |||
| JP2003193009A | 2003-07-09 | |||
| JPH01294393A | 1989-11-28 | |||
| JPS5559921A | 1980-05-06 | |||
| JP2003238745A | 2003-08-27 | |||
| JP2003193009A | 2003-07-09 | |||
| JP2014037489A | 2014-02-27 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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