Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
DISASSEMBLING DEVICE
Document Type and Number:
WIPO Patent Application WO/2016/155402
Kind Code:
A1
Abstract:
Disclosed is a disassembling device for disassembling an assembly, such as a touch control screen, the assembly (10) comprising a first substrate (11) and a second substrate (12) arranged opposite to each other, and an adhesive being provided between the first substrate (11) and the second substrate (12). The disassembling device comprises two fixing mechanisms (20) arranged opposite to one another, wherein the two fixing mechanisms (20) are used for respectively fixing the first substrate (11) and the second substrate (12), and the two fixing mechanisms (20) may have relative motion therebetween so as to be close to each other or far away from each other. The disassembly device further comprises an adhesive processing mechanism for processing the adhesive, so that the adhesive force between the processed adhesive and the substrates is less than that between the adhesive before processing and the substrates. The device can be used to effectively disassemble the first substrate and the second substrate, which are adhered to each other, without destroying the first substrate or the second substrate.

Inventors:
ZHAO TINGTING (CN)
Application Number:
PCT/CN2016/070326
Publication Date:
October 06, 2016
Filing Date:
January 07, 2016
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
BOE TECHNOLOGY GROUP CO LTD (CN)
HEFEI BOE OPTOELECTRONICS TECH (CN)
International Classes:
B32B38/10; B32B37/12
Foreign References:
CN104097382A2014-10-15
CN104129150A2014-11-05
CN103909722A2014-07-09
US20120234497A12012-09-20
CN104760400A2015-07-08
Attorney, Agent or Firm:
TEE&HOWE INTELLECTUAL PROPERTY ATTORNEYS (CN)
北京天昊联合知识产权代理有限公司 (CN)
Download PDF:
View/Download PDF      PDF Help



 
Previous Patent: MULTIFUNCTIONAL BELT BUCKLE

Next Patent: ULTRASONIC DETECTION AND LOCATING METHOD AND DEVICE BASED ON TOFD AND PHASED ARRAY