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Patent Searching and Data


Title:
DISCONTINUOUSLY LAYERED FLEXIBLE LAMINATION LAMP STRIP CIRCUIT BOARD AND MANUFACTURING METHOD THEREFOR
Document Type and Number:
WIPO Patent Application WO/2021/057321
Kind Code:
A1
Abstract:
The present invention relates to a discontinuously layered flexible lamination lamp strip circuit board and a manufacturing method therefor. Specifically, the method comprises: printing an adhesive on multiple positions on a local part of a back surface of a single-layer flexible circuit board or a double-layer flexible circuit board designed with a through hole; then manufacturing a metal single-layer circuit board; adhering the circuit board of which the back surface is printed with the adhesive to the metal single-layer circuit board, so as to form a discontinuously adhesive and discontinuously layered structure, thereby manufacturing a double-layer or three-layer circuit board, and such circuit board is a circuit board having a layered structure at multiple discontinuous positions. A layered structure without the adhesive is provided at multiple local positions between a single-layer circuit board part on a lower layer of the back surface, and a single-layer circuit board on an upper layer or the double-layer circuit board, and such layered circuit board is used for a manufactured LED lamp strip, so that the lamp strip is more resistant to bending during bending.

Inventors:
WANG DINGFENG (CN)
XU WENHONG (CN)
RAN CHONGYOU (CN)
XU LEI (CN)
JU SHENGTAO (CN)
Application Number:
PCT/CN2020/109147
Publication Date:
April 01, 2021
Filing Date:
August 14, 2020
Export Citation:
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Assignee:
WANG DINGFENG (CN)
International Classes:
H05K3/46; F21S4/24
Foreign References:
CN103906344A2014-07-02
CN105172089A2015-12-23
CN109282179A2019-01-29
Attorney, Agent or Firm:
EASWAYER LAW FIRM (CN)
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