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Title:
DISK SUBSTRATE, MOLDING APPARATUS FOR INJECTION-MOLDING IT, AND DISK SUBSTRATE PICK-UP ROBOT
Document Type and Number:
WIPO Patent Application WO/2002/049027
Kind Code:
A1
Abstract:
A disk substrate having no burr on the edge of a center hole. A disk substrate (23) is provided at its center hole (24) with a straight portion (24a) and a tapered portion (24b) and on its edge of a signal transfer face (22) of the tapered portion (24b) with an R- or C-shaped face (24c). A molding apparatus most suitable to mold such a disk substrate (23) and a disk pick-up apparatus are disclosed.

Inventors:
NAKANO JUN (JP)
SHIMIZU JUN (JP)
MINEMURA KEN (JP)
Application Number:
PCT/JP2001/010793
Publication Date:
June 20, 2002
Filing Date:
December 10, 2001
Export Citation:
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Assignee:
SONY CORP (JP)
NAKANO JUN (JP)
SHIMIZU JUN (JP)
MINEMURA KEN (JP)
International Classes:
B29C45/26; B29C45/38; B29C45/42; B29D17/00; G11B5/73; G11B7/24; G11B7/26; G11B23/00; B29C45/17; G11B11/105; (IPC1-7): G11B7/26; G11B7/24; B29C45/26; B29C45/37
Foreign References:
JPH05278043A1993-10-26
JPH0376615A1991-04-02
JPS63206925A1988-08-26
JPH0379322A1991-04-04
JP2000317995A2000-11-21
JPH0768604A1995-03-14
Other References:
See also references of EP 1343160A4
Attorney, Agent or Firm:
Nakamura, Tomoyuki c/o Miyoshi International Patent Office 9th Floor (Toranomon Daiichi Building 2-3 Toranomon 1-chome Minato-ku, Tokyo, JP)
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