DISSOLUTION RATE MODIFIERS FOR PHOTORESIST COMPOSITIONS

Title:

DISSOLUTION RATE MODIFIERS FOR PHOTORESIST COMPOSITIONS

Document Type and Number:

WIPO Patent Application WO2004074933

Kind Code:

A3

Abstract:

Oligomers of polycyclic olefin monomers, and optionally allylic or olefinic monomers, and a method of making such oligomers that includes reacting polycyclic olefin monomers in the presence of a Ni or Pd containing catalyst, or in the case of allylic monomers in the presence of a free radical initiator. The oligomers can be included in photoresist compositions as dissolution rate modifiers. The photoresist compositions can further include a polymeric binder resin, a photoacid generator, and solvents.

Inventors:

RHODES LARRY F (US)
SEGER LARRY (US)
GOODALL BRIAN L (US)
MCINTOSH LESTER H III (US)
DUFF ROBERT J (US)

Application Number:

PCT/US2004/005043

Publication Date:

November 09, 2006

Filing Date:

February 20, 2004

Export Citation:

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Assignee:

PROMERUS LLC (US)
RHODES LARRY F (US)
SEGER LARRY (US)
GOODALL BRIAN L (US)
MCINTOSH LESTER H III (US)
DUFF ROBERT J (US)

International Classes:

G03C1/76; G03F7/004; G03F7/038; G03F7/039; G03F7/085; G03F

Foreign References:

US20040265738A1	2004-12-30
US6908724B2	2005-06-21

Other References:

WILLSON ET AL.: "Fluorinated Polymers and Dissolution Inhibitors for 157 nm Microlithography, Polymer Materials", SCIENCE & ENGINEERING (ABSTRACT 12), vol. 87, 2002, XP008091906
See also references of EP 1597627A4

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