Title:
DOUBLE GRINDING METHOD
Document Type and Number:
WIPO Patent Application WO/2020/137187
Kind Code:
A1
Abstract:
This double grinding method comprises: a first grinding step in which grinding is performed until the thickness of a first wafer reaches a prescribed thickness while a grinding fluid is supplied in a prescribed amount to first and second main surfaces of the first wafer; a nanotopography measurement step in which the nanotopography of the first wafer is measured; and a second grinding step in which a grinding condition is adjusted on the basis of the result of the measurement performed in the nanotopography measurement step so that the nanotopography of a second wafer approaches zero, and grinding is performed until the thickness of the second wafer reaches the prescribed thickness. In the second grinding step, while the total amount of grinding fluid supplied in the first grinding step is maintained, the ratio of the amount of grinding fluid supplied to the first main surface of the second wafer and the amount of grinding fluid supplied to the second main surface of the second wafer is adjusted, and the second wafer is ground.
Inventors:
NISHIMURA YOSHINOBU (JP)
Application Number:
PCT/JP2019/043882
Publication Date:
July 02, 2020
Filing Date:
November 08, 2019
Export Citation:
Assignee:
SUMCO CORP (JP)
International Classes:
B24B7/17; B24B49/03; B24B49/04; H01L21/304
Domestic Patent References:
| WO2017061486A1 | 2017-04-13 |
Foreign References:
| JP5494552B2 | 2014-05-14 | |||
| JPS5439217B2 | 1979-11-27 | |||
| JP2000024892A | 2000-01-25 |
Attorney, Agent or Firm:
KINOSHITA & ASSOCIATES (JP)
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