DOUBLE-SIDED WAFER POLISHING METHOD AND DOUBLE-SIDED POLISHING APPARATUS

WIPO Patent Application WO/2018/193758

A1

The present invention provides a double-sided wafer polishing method for placing multiple double-sided polishing carriers in a double-sided polishing apparatus and performing double-sided polishing of wafers, wherein, when readying a carrier set comprising multiple double-sided polishing carriers to be disposed between upper and lower surface plates: the amount of waviness, calculated from data measuring the shape of the double-sided polishing carrier using a shape measuring machine, is acquired for all of the multiple double-sided polishing carriers of the carrier set; a carrier set for which the difference between the maximum value and minimum value for the amounts of waviness among the multiple double-sided polishing carriers in the carrier set is not more than a fixed value is selected and readied; and the carrier set is placed in the double-sided polishing apparatus and double-sided polishing of wafers is performed. Provided thereby are a double-sided wafer polishing method and a double-sided polishing apparatus with which differences (variations) in flatness can be limited among the wafers obtained by double-polishing using the multiple double-sided polishing carriers.

TANAKA YUKI (JP)
KITAZUME DAICHI (JP)

PCT/JP2018/009962

October 25, 2018

March 14, 2018

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SHINETSU HANDOTAI KK (JP)

B24B37/28; B24B49/12; H01L21/304

JP2004148497A	2004-05-27
JP2015174168A	2015-10-05
JP2014176954A	2014-09-25
JP2011143477A	2011-07-28
JP2004303280A	2004-10-28
JP2013132744A	2013-07-08
JP2010023217A	2010-02-04
JP2009190125A	2009-08-27
JP2016124053A	2016-07-11
JP2015208840A	2015-11-24

YOSHIMIYA Mikio et al. (JP)

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