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Patent Searching and Data


Title:
DUAL-CONTACT MEMORY CONNECTOR
Document Type and Number:
WIPO Patent Application WO/2019/091127
Kind Code:
A1
Abstract:
Disclosed in embodiments of the present application is a dual-contact memory connector, for use in enhancing the connectivity between a DIMM spring and the golden finger of a memory chip, lowering the probability of poor contact between a DIMM slot and the memory chip, improving production efficiency, and reducing device production costs. The connector comprises an insulated base (301), clips (302), a contact spring assembly (303), and a fixing assembly (304). The insulated base (301) is provided with a slot (305) which is used for insertion of a memory chip. The clips (302) are located at the two ends of the insulated base (301). The contact spring assembly (303) comprises a plurality of pairs of contact spring structures (306), each contact spring structure (306) is provided with two contact points, and the contact spring structures (306) are connected to the golden finger of the memory chip by means of the two contact points. The fixing assembly (304) is located at the bottom of the insulated base (301).

Inventors:
CHEN LIPING (CN)
WANG FENG (CN)
YAN BO (CN)
Application Number:
PCT/CN2018/093387
Publication Date:
May 16, 2019
Filing Date:
June 28, 2018
Export Citation:
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Assignee:
HUAWEI TECH CO LTD (CN)
International Classes:
H01R12/71; H01R13/24
Foreign References:
CN207381578U2018-05-18
CN107994364A2018-05-04
CN207818948U2018-09-04
CN101931136A2010-12-29
CN201417837Y2010-03-03
CN205680828U2016-11-09
CN2442303Y2001-08-08
Attorney, Agent or Firm:
SHENPAT INTELLECTUAL PROPERTY AGENCY (CN)
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